www.design-reuse-embedded.com
Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...

SiFive Expands DesignShare IP Ecosystem to 20 Partner Companies

Signature third-party IP ecosystem allows low-cost, rapid prototyping and innovative IP licensing for AI, edge computing

SAN MATEO, Calif., July 1, 2019 -- SiFive, Inc., the leading provider of commercial RISC-V processor IP and silicon solutions, announced today that it has expanded its DesignShare ecosystem to 20 portfolio companies and strengthened the third-party IP available to developers of SoCs designed for use in artificial intelligence (AI) and edge inference. As SoC design and IP costs rise for advanced nodes, SiFive continues to deliver innovative business models in order to democratize access to optimized silicon by improving design efficiency for driving differentiated System-on-Chip (SoC) solutions to market.

For more information, please visit: www.sifive.com

More

With the AI silicon market forecast to reach $30 billion by 2023, SiFive is developing AI platforms in leading FinFET nodes for computer vision, edge inferencing and training applications. The deployment of highly optimized silicon at the edge will require the customizability and capabilities afforded by SiFive's 64-bit RISC-V processors. The cost and effort of acquiring IP for such use cases, however, has traditionally been a high barrier to building new custom SoCs. SiFive's DesignShare ecosystem addresses these challenges by providing key IP for any silicon engagement as well as selected, tested and integrated IP solutions for targeted applications.



RISC-V IP Cores

Following its recent announcements of securing over 100 design wins and the introduction of the industry's first template SoCs, SiFive's latest DesignShare IP ecosystem additions include cryptographic security solutions, in-chip monitoring, memory compilers, interconnects and controllers, clock management and SerDes. With existing offerings such as GPUs and accelerators, SiFive's DesignShare ecosystem offers a complete portfolio of leading and differentiating IP for custom SoC and Template SoC development, optimized for AI, IoT and edge inference.

"AI development is driving semiconductor design in many markets," said Mohit Gupta, vice president, SoC IP solutions, SiFive. "As we continue to develop complete solutions on advanced FinFET nodes, it is critical to bundle key and differentiating IP from market leaders with our RISC-V core IP and silicon expertise in order to realize the much-needed higher TOPS per milliwatt with low latency performance, while balancing the needs for low power and smaller area footprints. We bring unique capabilities to edge inference use cases and our enhanced DesignShare ecosystem now provides all critical IP for next generation SoCs and accelerators."

The need for highly specialized IP is only deepening with increased silicon specialization for specific workloads and the demand for domain-specific architectures. To meet these needs directly for customers, SiFive has added numerous key offerings to its DesignShare ecosystem, including:

"With the depth and breadth of our third-party IP portfolio coupled with our highly efficient RISC-V Core IP, we can now truly offer customers and partners a 'your block here' solution to advanced AI SoCs," said Naveed Sherwani, president and CEO, SiFive. "With the leading IP for IoT, edge and AI workloads in our DesignShare ecosystem, we extend deep customization and selection of differentiating IP to our customers to power the latest IP, algorithms and accelerators. Our architectural and implementation expertise allows our customers and partners to focus on their unique capabilities while we improve PPA and a provide a fast path to silicon."

 Back

Partner with us

List your Products

Suppliers, list and add your products for free.

More about D&R Privacy Policy

© 2024 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.