www.design-reuse-embedded.com
SEARCH SOLUTIONS   
    • Categories
    • RISC-V
    • Embedded Processing
    • 5G, 3GPP LTE SoCs
    • IoT SoCs
    • Artificial Intelligence SoCs
    • Automotive SoCs
    • Space and Avionics
    • Security Solutions & SoCs
    • Audio & Video SoCs
    • Design Platforms
    • Monitoring and Verification
    • SoC Design Services
    • Find your best SoC design partner
Partner Videos D&R Events
    • IP-SoC Days 2024
    • IP-SoC Days 2023
    • IP-SoC Days 2022
    • IP-SoC Days 2021
    • IP-SoC Days 2020
    • IP-SoC 2023
    • IP-SoC 2022
    • IP-SoC 2021
    • IP-SoC 2020
On Demand Webinars NEWS
Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...

AMS, Qualcomm partner on 3D biometrics

Sensor solutions manufacturer ams announced a partnership with Qualcomm Technologies to jointly develop a 3D depth sensing camera solution for mobile phone applications like 3D imaging and scanning and, in particular, biometric face authentication.

eenewseurope.com, Nov. 21, 2018 – 

With ams' advanced VCSEL light sources and optical IR pattern technology incorporating mass-production proven wafer level optics and Qualcomm's Snapdragon Mobile Platforms, the two companies aim to deliver a reference design for a cost-attractive, active 3D stereo camera solution for Android-based mobile phones.

Use cases for the platform solution could include front-facing applications that require advanced 3D imaging such as face recognition required for secure online payments as well as other applications like dynamic-depth facial scanning.

Click here to read more

 Back

Partner with us

Contact Us
Partnership Offers

List your Products

Suppliers, list and add your products for free.

List your Products

More about D&R Privacy Policy

© 2024 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted, reposted, duplicated or otherwise used without the express written permission of Design And Reuse.