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AMS, Qualcomm partner on 3D biometrics

Sensor solutions manufacturer ams announced a partnership with Qualcomm Technologies to jointly develop a 3D depth sensing camera solution for mobile phone applications like 3D imaging and scanning and, in particular, biometric face authentication.

eenewseurope.com, Nov. 21, 2018 – 

With ams' advanced VCSEL light sources and optical IR pattern technology incorporating mass-production proven wafer level optics and Qualcomm's Snapdragon Mobile Platforms, the two companies aim to deliver a reference design for a cost-attractive, active 3D stereo camera solution for Android-based mobile phones.

Use cases for the platform solution could include front-facing applications that require advanced 3D imaging such as face recognition required for secure online payments as well as other applications like dynamic-depth facial scanning.

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