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CEVA's 2018 Technology Symposium Series Coming to Taiwan, China and Japan


MOUNTAIN VIEW, Calif. -- Oct. 15, 2018 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of signal processing platforms and artificial intelligence processors for smarter, connected devices, today announced that its 2018 Technology Symposium Series will be the largest yet, expanding to include five locations in Asia, with more than one thousand engineers expected to be in attendance. This year, this free series of one day events focuses on realizing the potential of AI at the Edge and harnessing its benefits for next-generation embedded designs. It will also explore the latest IoT and cellular connectivity solutions, including 5G, cellular IoT, Bluetooth 5 and Wi-Fi 6 (802.11ax).

Register here: https://events.ceva-dsp.com/symposium-2018-en/ to attend at any of the following locations:

Hsinchu, Taiwan on October 29; Shenzhen, China on October 31; Shanghai, China on November 2; Beijing, China on November 5, and; Tokyo, Japan on November 7.

CEVA's product specialists, ecosystem partners and leading industry experts will join together for a full day of visionary and technical sessions. Topics covered include:

Following the sessions, attendees can interact with CEVA staff, customers and partners, and see a wide range of demonstrations and devices deploying these technologies in real-world use cases.

Partners and customers participating in this year's Technology Symposium Series include Abilisense, Alibaba, Arcsoft, Artosyn, Autotalks, Catena, GMV, Huachang, Immervision, LIPS, Nextchip, Rockchip, Silentium, Socionext, and Tempow. Participants vary by location and are subject to change. For more information, visit: https://events.ceva-dsp.com/symposium-2018-en/.

About CEVA, Inc.

CEVA is the leading licensor of signal processing platforms and artificial intelligence processors for a smarter, connected world. We partner with semiconductor companies and OEMs worldwide to create power-efficient, intelligent and connected devices for a range of end markets, including mobile, consumer, automotive, industrial and IoT. Our ultra-low-power IPs for vision, audio, communications and connectivity include comprehensive DSP-based platforms for LTE/LTE-A/5G baseband processing in handsets, infrastructure and cellular IoT enabled devices, advanced imaging and computer vision for any camera-enabled device, audio/voice/speech and ultra-low power always-on/sensing applications for multiple IoT markets. For artificial intelligence, we offer a family of AI processors capable of handling the complete gamut of neural network workloads, on-device. For connectivity, we offer the industry's most widely adopted IPs for Bluetooth (low energy and dual mode) and Wi-Fi (Wi-Fi 4 (802.11n), Wi-Fi 5 (802.11ac) and Wi-Fi 6 (802.11ax) up to 4x4). Visit us at www.ceva-dsp.com

CEVA's 2018 Technology Symposium Series Coming to Taiwan, China and Japan

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