www.design-reuse-embedded.com
Find Top SoC Solutions
for AI, Automotive, IoT, Security, Audio & Video...

TSMC to Start 5nm Production in April

SAN JOSE, Calif. , Oct. 05, 2018 – 

TSMC taped out its first chip in a process making limited use of extreme ultraviolet lithography and will start risk production in April on a 5-nm node with full EUV. Separately, the foundry forged partnerships with four partners to support online services for back-end chip design.

The foundry's update showed that area and power gains continue in its leading-edge nodes, but chip speeds are no longer advancing at their historic rate. To compensate, TSMC gave an update on a half-dozen packaging techniques that it is developing to speed connections between chips.

Backers say that cloud-based services will shorten the time and extend the reach of chip design tools, helping expand a semiconductor industry facing the slowdown of Moore's Law. However, they note that cloud design is still in an early phase that typically requires setting up and optimizing custom sites.

Click here to read more ...

 Back

Partner with us

Visit our new Partnership Portal for more information.

Submit your material

Submit hot news, product or article.

List your Products

Suppliers, list and add your products for free.

More about D&R Privacy Policy

© 2018 Design And Reuse

All Rights Reserved.

No portion of this site may be copied, retransmitted,
reposted, duplicated or otherwise used without the
express written permission of Design And Reuse.