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TSMC and ANSYS Accelerate Automotive Reliability Solutions

Companies release expanded guidelines for advanced reliability analysis for TSMC 7nm FinFET process technology

PITTSBURGH, Oct. 03, 2018 – 

Customers of TSMC and ANSYS (NASDAQ: ANSS) can accelerate the production of automotive design features through the Automotive Reliability Solution Guide 2.0, an outline of proven workflows to support customers' intellectual property (IP), chip and package development for TSMC 7nm FinFET(N7) process technology. Based on TSMC and ANSYS collaboration on reliability solutions in ANSYS® RedHawk™, ANSYS® RedHawk-CTA™, ANSYS® Totem™ and ANSYS® Pathfinder-Static™, the expanded guide empowers customers to develop more efficient and robust chips for the next generation of smart automobiles.

Reliability is critical for the cutting-edge automotive platforms used in advanced driver assistance systems, infotainment controls and autonomous driving. The expanded guidelines incorporate various reliability capabilities in one place to support mutual customers' IP, chip and package development for automotive applications in TSMC's N7 process technology. The guide includes workflows for electromigration (EM), thermal reliability including self-heat and chip package thermal co-analysis and electrostatic discharge. It also includes a new workflow for statistical electromigration budgeting (SEB).

SEB enables chip designers to meet stringent safety and reliability requirements by prioritizing the most important EM fixes for signoff while avoiding over design to achieve lower cost, higher performance and greater product reliability. RedHawk and Totem are enabled with advanced SEB modeling for TSMC's latest FinFET process technology.

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