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IDM or foundry: CanSemi builds on analog, MCU strategy

Aug. 08, 2018 – 

CanSemi Technology Inc. broke ground on its 300mm wafer fab on December 26, 2017 and claims to have 7 billion yuan (about US$1 billion) of investment available. It will make chips using manufacturing processes from 0.18-micron down to 0.13-micron but what remains unclear is whether CanSemi will be an integrated device manufacturer or a foundry – or will try to fulfil both functions.

The wafer fab site covers 140,000 square meters and manufacturing capacity will ramp up to 40,000 wafer starts per month, the company states on its website. First wafers are expected out in 2019. CanSemi states that it is committed to becoming an international top-tier IDM. It will do that by providing chips for the IoT and automotive markets with product lines in MCUs, PMICs, analog ICs and power discretes.

The company may itself be customer for foundry services in microcontrollers if its own fab is focused on analog manufacturing. It states on the website that it wants to go from being a virtual IDM today to a real IDM in the future.

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