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Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation


Details were disclosed at the company’s 3rd Annual US Samsung Foundry Forum

May 23, 2018 -- Samsung Electronics, a world leader in advanced semiconductor technology solutions, today unveiled a series of new silicon innovations at the heart of future high-performance computing and connected devices.

With comprehensive process technology roadmap updates down to 3-nanometer (nm) at the annual ‘Samsung Foundry Forum (SFF) 2018 USA’, Samsung Foundry is focused on providing customers with the tools necessary to design and manufacture powerful, yet energy-efficient system-on-chips (SoC) for a wide range of applications.

“The trend toward a smarter, connected world has the industry demanding more from silicon providers,” said Charlie Bae, executive vice president and head of the Foundry Sales & Marketing Team at Samsung Electronics. “To meet that demand, Samsung Foundry is powering innovation at the silicon level that will ultimately give people access to data, analysis, and insight in new and previously unthought-of ways to make human lives better. It is imperative for us to accomplish the first-time silicon success for our customers’ next-generation chip designs.”

Process Technology Roadmap Updates

HPC (High-Performance Computing) Solutions

Samsung IP Cores

Samsung Foundry delivers the technology solutions to drive the latest hyper-scale datacenters and accelerate the growth of Artificial Intelligence (AI) and Machine Learning capability. From the latest 7LPP technology and beyond with its EUV capability, to the differentiated high-speed IPs such as 100Gbps+ SerDes on top of the innovative 2.5D/3D heterogeneous packaging, Samsung delivers the total platform solutions to greatly increase computing power and accelerate AI revolution.

Connected Device Solutions

From low-power microcontroller units (MCU) and next-generation connected devices to the most sophisticated autonomous vehicles based on 5G and Vehicle to Everything (V2X) communication, Samsung Foundry offers full-featured turnkey platforms to enable compelling products. A broad technology portfolio from 28/18 FD-SOI with eMRAM and RF capability to advanced 10/8nm FinFET processes will enable a great end-user experience for connected devices.

Mr. Bae continued, “Over the past year, we have focused on strengthening our EUV process portfolio to provide each of our customers with the finest technologies. Applying GAA structure to our next generation process node will enable us to take the lead in opening a new smart, connected world, while also to reinforcing our technology leadership.”

Details regarding Samsung Foundry can be found at www.samsungfoundry.com

Samsung Set to Power the Future of High-Performance Computing and Connected Devices with Silicon Innovation

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