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TSMC Technologies for IoT and Automotive

May. 15, 2018 – At TSMC 2018 Silcon Valley Technology Symposium, Dr Kevin Zhang, TSMC VP of Business Development covered technology updates for IoT platform. The three growth drivers in this segment namely TSMC low power, RF enhancement and embedded memory technology (MRAM/RRAM) reinforced both progress and growth in global semiconductor revenue since 1980 --from PC, notebook, mobile phone, smartphone and eventually IoT. For 2017-2022 period, CAGR of 24% and 6.2B units of IoT end devices shipment by 2022 are projected.

RF Technology for IoT Connectivity.
While low power technology unleashes IoT innovation directing shifts from 0.18u eLL/90nm uLP → 55/40 ulP → 22 ULP/ULL → 12 FFC, AI has enabled voice and visual intelligence. Many applications such as voice, AI, audio analysis, surround view sensors and monitoring, etc. require low power technology. Advanced low leakage, embedded SRAM uLL, connectivity plus RF, and advanced eNVM are pillars that further the move to smart society with IoT and AI.

The current 22ULP/ULL technology offering is based on 28HPC+ manufacturing excellence. TSMC leveraged N28 silicon experience and design ecosystem.

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