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Cadence Supports New TSMC WoW Advanced Packaging Technology

Full suite of Cadence digital, signoff and custom/analog IC design tools coupled with advanced IC package design and analysis tools optimized for TSMC WoW technology

SAN JOSE, Calif. -- May 1, 2018 -- Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its full suite of Cadence® digital, signoff and custom/analog IC design tools, along with advanced IC packaging design solutions, support the new TSMC Wafer-on-Wafer (WoW) stacking technology.

For more information on the Cadence solutions that support the TSMC WoW technology, visit www.cadence.com/go/wowcowosinfo.

Support for WoW Advanced Packaging Technology

Cadence provides flows, tools and methodologies that enable TSMC customers to manage the top-level connectivity and verification of their chip integration solutions as part of the overall design process.

The Cadence tools have been optimized to provide a complete integrated flow for implementing WoW chip integration techniques within the existing toolchain and are as follows:

“The new WoW reference flow complements our established InFO and CoWoS® chip integration solutions and gives customers more flexibility to use advanced packaging techniques,” said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. “Cadence’s strong support for our packaging technologies is instrumental in enabling our mutual customers to achieve the benefits our solutions have to offer.”

“Cadence has a rich history in supporting TSMC’s solutions, and our support for TSMC’s WoW technology lets design engineers deploy the latest packaging techniques so they can get to market faster,” said Tom Beckley, senior vice president and general manager in the Custom IC & PCB Group at Cadence. “Our continued support for TSMC advanced packaging technologies also highlights our close working relationship with TSMC, and we are committed to ensuring customers have access to all the latest technologies to achieve their design goals.”

About Cadence

Cadence enables electronic systems and semiconductor companies to create the innovative end products that are transforming the way people live, work and play. Cadence® software, hardware and semiconductor IP are used by customers to deliver products to market faster. The company’s System Design Enablement strategy helps customers develop differentiated products—from chips to boards to systems—in mobile, consumer, cloud datacenter, automotive, aerospace, IoT, industrial and other market segments. Cadence is listed as one of Fortune Magazine's 100 Best Companies to Work For. Learn more at www.cadence.com.

Cadence Supports New TSMC WoW Advanced Packaging Technology

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