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Soitec to hire 300 people in 2018


Apr. 18, 2018 – 

Soitec SA (Bernin, France), developer of the "smart cut" method of silicon-on-insulator (SOI) wafer production, has announced a plan to hire 200 additional staff in 2018 at its main facility near Grenoble. At the same time Soitec plans to add 100 people outside France, at its Singapore and other sites.

Soitec embarked on a major change in its strategy in January 2015 and it has now fully refocused on its original business of microelectronics. The company was able to climb back into profit in 2017 and the recruitment drive is intended to maintain and build that momentum, the company said.

The job positions being opened up cover the full spectrum of work within the company. Multiple internships and work-study programs also will be offered – all paid – together with voluntary assignments to Soitec's Singapore subsidiary.

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