Globalfoundries gearing up to tap lucrative automotive chip market

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Taipei, Dec. 28, 2017 – 

Eyeing the explosive demand for automotive-use chips fueled by rapid development of electric vehicles, driverless cars and drones, Globalfoundries has created a brand-new automotive electronics technology platform, with its 12-inch wafer Fab1 in Dresden, Germany dedicated as a manufacturing base for automotive chipsets.

The firm's AutoPro technology platform is designed to provide automotive electronics customers with total solutions to simplify their product accreditation process and facilitate the launch of new smart cars, aiming to grab a larger slice of the global automotive semiconductor market, estimated to reach an annual level of US$54 billion by 2023.

The platform covers FD-SOI (fully depleted silicon on insulator), SiGe (silicon germanium), CMOS and FinFET processes, and can also offer ASIC design, packaging and silicon IP services, providing customers with full series of technologies and services to satisfy their needs for smart-car connections and applications.

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