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TSMC considers US for 3nm wafer fab site

By Peter Clarke , Mar. 29, 2017 – 

Foundry Taiwan Semiconductor Manufacturing Co. Ltd. is considering building a next-generation wafer fab with a nominal manufacturing node of 3nm in the US, according to reports.

TSMC is considering a number of locations - including the US - and the decision will be taken in the first half of 2018, a Bloomberg report quoted spokesperson Elizabeth Sun saying.

TSMC is world's largest foundry chip manufacturer and makes chips for a number of consumer electronics products including Apple's iPhone smartphones. The statements of President Trump about the need to bring jobs and investment to the country and the threat of tariffs may have helped get the US on to the short list of locations. Foxconn Technology Group, Apple's equipment assembly partner has also said it is considering building a factory in the US.

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