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New Cadence Allegro Platform Accelerates Design of Compact, High-Performance Products Using Flex and Rigid-Flex Technologies

Unique and comprehensive real-time DRCs for flex technology and dynamic concurrent team design accelerate product creation

MUNICH, Germany, May. 03, 2016 – 

Today at CDNLive EMEA, Cadence Design Systems, Inc. (NASDAQ: CDNS) unveiled the Allegro 17.2-2016 portfolio, which enables a more predictable and shorter design cycle. The portfolio features comprehensive in-design inter-layer checking technology that minimizes design-check-redesign iterations and a new dynamic concurrent team design capability that accelerates product creation time by up to 50 percent. Utilizing material inlay fabrication techniques, these new capabilities can reduce material costs by up to 25 percent. In addition, embedded SigrityTM technology now ensures critical signals meet performance criteria and power integrity (PI) for PCB designers addressing power delivery and IR-drop issues efficiently, eliminating time-consuming iterations with PI experts. For more information on the Allegro technology portfolio, please visit www.cadence.com/news/allegro172.

The Allegro portfolio includes key advancements that minimize design iterations and lower overall cost for flex and rigid-flex designs commonly used in automotive, consumer electronics, computing, communications, mobile and wearable applications. These capabilities include:

The Allegro portfolio now provides synchronous team design capability, which can shorten design time by up to 50 percent for dense designs and increase efficiency by enabling the team to design synchronously. This feature enables PCB designers to achieve maximum productivity by allowing up to five PCB designers to conduct real-time, concurrent PCB design work within the same design database, shortening time to route a dense design by up to 80 percent.

"Due to the nature of our business, flex designs are extremely critical to many of our products, specifically in the mobile and automotive space. The breadth and the depth of enhancements have the ability to significantly improve our PCB design productivity in designing for space-constrained applications," said Greg Bodi, director of System Engineering PCB Layout, Nvidia. "The new inter-layer check capability provides comprehensive in-design, real-time checks, which will save us significant time currently spent doing manual checks after layout is completed on advance flex and rigid-flex designs."

"The latest Allegro release provides many productivity and ease of use improvements," said Dave Elder, PCB Engineering manager at Tait Communications. "In-design inter-layer checks for flex and rigid-flex design is comprehensive and extensible, which can save us 20 to 25 percent time for rigid-flex designs. This will also allow us to retire some homegrown solutions we put in place."

"The new Allegro platform addresses many challenges faced by PCB designers on a daily basis," said Saugat Sen, vice president of R&D, PCB and IC Packaging Group at Cadence. "We continue to provide market-leading solutions with Allegro's extensive Rigid/Flex capabilities coupled with industry-leading power aware Sigrity SI/PI technology to reduce design cycle time for our customers' compact, high-performance products."

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at www.cadence.com.

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