Securing 2.5D and fan-outs

Rambus Blog, Oct. 13, 2015 – 

Semiconductor Engineering editor-in-chief Ed Sperling recently noted that the long-anticipated move to 2.5D and fan-outs raises a number of familiar questions about security.

"Will multiple chips combined in an advanced package be as secure as SoCs where everything is integrated on the same die? The answer isn't a simple yes or no," he opined. "Put in perspective, all chips are vulnerable to side channel attacks, hacking of memory -- a risk that increases with shared memory -- and monitoring of I/O over many different protocols and communications possibilities involving the Internet of Everything (IoE)."

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