Shifting the Mobile & Wearable Market -- SoC vs. SiP

While Moore's Law is slowing System-in-Package (SiP) and heterogeneous integration are taking up the challenge.

by EETimes Blog - William Chen, ASE Group, Sept. 29, 2015 – 

The smartphone has been the major driver for innovation in both the IC and electronic industries. As the smartphone market slowly matures, we are seeing extensive proliferation of connected devices and systems. Their continued infusion into the fabric of our society is leading us further toward global transformation within the eras of the Internet of Things (IoT), big data and data analytics, to the cloud. Also advancing quickly are wearables, connected vehicles, advanced robotics, intelligent factories, digital medical care and health care, smart homes, and smart cities. Going forward, what will be the technology requirements in these areas? And how will our industry come together to respond in meeting these requirements?

On the 50th anniversary of Gordon Moore's paper introducing Moore's Law, these disruptive changes in the fast-moving, consumer-driven market landscape call for a refocusing and broadening of the semiconductor industry's technical direction. This includes the reinterpretation of the promise of integration -- from homogeneous integration (scaling) and System-on-Chip (SoC) to heterogeneous integration and System-in-Package (SiP).

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