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Go! FD-SOI Wafer Suppliers Ready for High-Volume Ramp; Atomic-Scale Uniformity Assured

by Adele HARS - Advanced Substrate News, Jul. 21, 2015 – 

With the great news about FD-SOI foundry offerings from Samsung, ST and now GlobalFoundries, plus the IP availability, the wafer suppliers have chimed in to remind the ecosystem they're ready to ramp (and have been for a number of years!). So the wafers are ready (and they truly are amazing), the processes ensuring high yield are in place, and high-volume capacity is ready to roll. Most recently in the wafer news, top-10 equipment supplier Screen Semi Solutions has joined the ecosystem with wafer cleaning processes that ensure and maintain the requisite wafer uniformity in high-volume FD-SOI wafer production.

The industry-standard process for making all the different flavors of silicon-on-insulator (SOI) wafers (FD-SOI, RF-SOI, power, photonics, etc.) is Soitec's Smart CutTM technology. Invented at Leti and industrialized by Soitec, Smart Cut made its world debut at Semicon West 20 years ago (!!) in 1995.

But for FD-SOI, the SOI wafers needed to meet new exigencies of extremely thin and uniform top silicon and an extremely thin insulating (aka Buried Oxide, or BOx) layer. Consider this: uniformity of the top silicon layer of Soitec FD-2D wafers (that's the wafer product name) is guaranteed to within +/-5 at all points on all wafers. This uniformity is equivalent to 5 mm over 3,000 km, which corresponds to approximately 0.2 inches over the distance between Chicago and San Francisco. Meeting this requirement is not new: Soitec announced they were ready for industrialization with this level of uniformity back in 2010.


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