What does 3D integration have in store for semiconductor and related industries in 2015?

by Jean-Christophe ELOY - 3DInCities, Jan. 20, 2015 – 

Yole Developpement invites you to discover the main technology trends and business opportunities for 3D integration in 2015. As a research market & strategy consulting company, Yole Developpement (Yole) works with the leaders of the advanced packaging industry every day to understand technical challenges and market issues. In this article, Yole's analysts detail their vision of the industry, extracted from the technology & market analysis, 3DIC & 2.5D TSV Interconnect for Advanced Packaging 2014 Business Update.

3D integration has been in volume production for more than eight years for MEMS and CMOS image sensor products. 2006 was the year for the adoption of through-silicon vias (TSVs) in volume manufacturing, but not in the mainstream semiconductor business, which is focused on memory and logic devices. Today, the need for higher performance products - with or without cost constraints - is clearly driving broader adoption of 3D integration. Small volume field-programmable gate arrays (FPGAs) are now being followed by high-end memory and processor applications that use TSVs in volume manufacturing.

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